| 摘要 |
PURPOSE:To provide a semiconductor integrated circuit device which has an higher yield and a higher reliability and to provide a method for wiring thereof by preventing breaking or short of wiring when bending appears on a hoop frame. CONSTITUTION:A hoop frame 1, a continuously connected lead frame, is constituted of leads 3 on which semiconductor elements 2 are mounted, leads 4 (the other ones) to be electrically connected to the semiconductor elements by wiring 5, and a frame 6 which supports pairs of the lead 3 and the lead 4 and is one continuous body. In this hoop frame 1, the lead 3 and the lead 4 are so positioned that a support axis 3a of the lead 3 and a support axis 4a of the lead 4 to be connected to the semiconductor element 2 by wiring 5 may be on one and the same axial line which is vertical to the hoop frame 1 carrying direction 7. |
