MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE,申请号JP19930158221-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0714961(A)	申请公布日期	1995.01.17
申请号	JP19930158221	申请日期	1993.06.29
申请人	TOSHIBA CORP	发明人	ECHIZENYA MASANOBU
分类号	H01L23/50;(IPC1-7):H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

您可能感兴趣的专利

VIBRATION TAMPING MACHINE

VARIABLE-DIAMETER WINDING SHAFT

APPARATUS FOR BRAKING RAIL VEHICLES

POWER AND AIR DISTRIBUTOR FOR RAILWAY VEHICLE BRAKE

PNEUMATIC RESILIANT MEMBER

SELF-LOCKING DIFFERENTIAL CEAR

STACKING PRESS ON MOVABLE PLATFORM

TOOL FOR BURNISHING INTERNAL CYLINDRICAL SURFACES

METHOD OF LOCATING THE BREAK OF METAL SHEET COATING

APPARATUS FOR CUTTING TUBES

ARRANGEMENT FOR MACHINING HOLES

APPARATUS FOR RADIAL MOVEMENT OF CUTTER

METHOD OF ADJUSTING PRODUCTION PROCESS

COLD-HARDENING MIX FOR MAKING MOULDS AND CORES

APPARATUS FOR PRODUCING PROCESSABLE CHIPS WHEN CUTTING VENEER

UNIT OF LAMINAR HALF-DIES

MULTIPURPOSE HYDRAULIC CYCLONE

SCREEN FOR SEPARATING LOOSE MATERIAL