| 摘要 |
PURPOSE: To lessen the deformation of the leads in an IC chip, even when the leads are thinner, or each interval between the leads becomes narrower by performing improved mold-packaging of the leads protruding from its package. CONSTITUTION: In a plastic-molded circuit package, a plurality of leads 14 protruding from an IC unit protrude from an integrated circuit unit 15. The leads have an outside section 18 which makes electrical contact with inside sections and external contacts, and center sections, and the outside sections are formed on surfaces different from the inside sections. The inside sections and the center sections are completely surrounded within plastic materials, and the outside sections are embedded in the plastic materials. Only the outside conductive surface of each lead is exposed for the electrical connection. The outside conductive surface is substantially flush with the bottom surface of the molded package. |
