ROTARY CHEMICAL SOLUTION CLEANING METHOD AND DEVICE

摘要

PURPOSE:To cut down the consumption of chemical solution, cleaning time and the numbers of applicable chemicals by a method wherein the washing step of the chemical solution fed downward to the surface of the cleaned element and the ultra pure water washing step for respective chemical solutions are to be performed in the same cleaning vessel. CONSTITUTION:A wafer 15 is set on a chuck 4 and then a sealing hood 16 is closed. Next, ultra pure water is fed from the fifth nozzle to the wafer 15 surface to be rotated for evenly wetting the wafer surface. Successively, ozonous ultrapure water is fed from the fifth nozzle to oxidize the organic material on the surface simultaneously forming a natural oxide film on the wafer surface and then ozone from the fifth nozzle is stopped to be rinsed with the ultrapure water for washing away the ozonous ultrapure water and impurities. Next, the mixed chemical solution of hydrofluoric acid and hydrogen peroxide is fed from the first nozzle to come off the surface natural oxide film further feeding the ultrapure water from the fifth nozzle for washing away the chemical solution and impurities. Through these procedures, the whole step can be continuously performed in the same vessel.