发明名称 ETCHING DEVICE
摘要 <p>PURPOSE:To provide a clean etching device, which enlarges the etching region of a wafer and at the same time, does not cause the generation of dusts. CONSTITUTION:A clamp 15 is provided so as to prevent from making contact to an orientation flat part 19 in a state of contact with a wafer W. A ceramic member 20 is made to adhere to part of a lower electrode 14 which is exposed to plasma. By constituting in such a way, the etching region of the wafer W is enlarged and at the same time, it becomes possible to prevent the device from causing the raising a dust.</p>
申请公布号 JPH0714823(A) 申请公布日期 1995.01.17
申请号 JP19930143194 申请日期 1993.06.15
申请人 SONY CORP;TOKYO ELECTRON LTD;TOKYO ELECTRON YAMANASHI KK;TOKYO ELECTRON F II KK 发明人 YAMANE TETSUYA;KOYAIZU TSUTOMU;IWANAGA TAKEAKI
分类号 H01L21/302;A01G9/08;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/306 主分类号 H01L21/302
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