| 摘要 |
PURPOSE:To surely bond a small ball by a method wherein balls provided to the tips of wires are set stable without fluctuation in diameter, hardness and the like in a wire bonding method carried out in a semiconductor device manufacturing process, CONSTITUTION:In a wire bonding method wherein a voltage is applied between the tip of a wire and a torch electrode to melt the tip of a wire into a ball, and the ball is bonded to a joint by pressure, a first process wherein the temperature of the tip of a wire is detected just before a ball is formed, a second process wherein a torch electrode is set optimal in conditions corresponding to the temperature of a wire tip detected in a preceding process, and a third process wherein a ball is formed on the tip of a wire under the conditions set in the second process are provided. |
