| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conductive compound which can be used in a semiconductor device as a heat conductor means, is excellent in heat conduction, and can absorb and lighten a thermal stress without causing any phase separation. SOLUTION: The heat conductive compound contains 15-60 volume % of a thermoplastic carrier resin made of a copolymer of plasticizer and ethylene, or a copolymer of polymer of plasticizer and polyethylene, 40-85 volume % of heat conductive filler particles dispersed into the carrier resin, and 0.5-5 weight % of dispersant having hydrophilic groups and hydrophobic groups added to the filler particles. The compound can be used as a heat conductive means which has a high thermal conductivity, has a good adhesion to a semiconductor element or the like and thus a quick heat conduction, and absorb or lightens a thermal stress, without causing any phase separation with high reliability. |
