| 摘要 |
PROBLEM TO BE SOLVED: To avoid a defective contact between an electronic component and a package substrate by a method, wherein the cracking in a packaging substrate caused due to external impacts is avoided for avoiding the disconnection in a leading out wiring arranged in the packaging substrate. SOLUTION: In order to terminate the whole terminal end of the junction of solder bumps 7 with an outermost peripheral electrode 2a at the inner peripheral part of the electrode 2a positioned on the outer periphery from among multiple electrodes 2 arrayed on a multilayered printed wiring board 3, the outer peripheral part of the electrode 2a is covered with a solder resist 10. Through these procedures, since the end part of the outermost peripheral electrode 2a which is most likely to cause crackings does not coincide with the stress concentration point in an external impact time, the cracking in the multilayered printed wiring board 3 is avoided, thereby enabling the defective contact between a BGA package 1 and the multilayered printed wiring board 3 to be prevented. |
