| 摘要 |
PURPOSE:To reduce the stress damage to semiconductor parts by applying a pressurizing force to the semiconductor parts brought into contact with the joint surface of a substrate by supplying a high-pressure gas from the holding surface of a holding means. CONSTITUTION:After bringing semiconductor parts held by a suction collet 18 into contact with a substrate, the semiconductor parts are released from the attracting and holding state by stopping the evacuation from a vacuum pressure source while the collet 18 is maintained at the same position. At the same time, a load is applied to the semiconductor parts by blowing separately set high-pressure air upon the collet 18 through an air passage 19. Namely, the high-pressure air is uniformly blown upon the entire surface of the semiconductor parts from the attracting surface of the 18 and a pressurizing force is applied to the parts proportionally to the high-pressure air in a non-contacting state. As a result, the semiconductor parts are pressed against the joint surface of the substrate and both the parts and substrate are firmly stuck to each other. |
