| 摘要 |
PURPOSE:To prevent semiconductor reliability deterioration due to cracks caused by stress by the temperature variation of external environment and provide a semiconductor device with low heat resistance at low cost. CONSTITUTION:An opening 12 is provided on a tab 2, a stress buffer plate 8 formed of material which has a smaller thermal expansion coefficient than that of the tab is inserted into the opening 12 and the stress buffer plate 8 is adhered to a heat resistant film attached to the rear plane of the tab. |
