发明名称 Soldering flux
摘要 A soldering flux composition includes an aqueous solution containing as component (A) a compound selected from (i) hydrohalides and hydrophosphates of guanidine and substituted guanidines, (ii) hydrohalides and hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula CxNyH3 in which x is 1 or 2 and y is 4 or 5, and mixtures of (i) and (ii) and as component (B) at least one compound selected from hydrohalides and hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH3(CH2)nNR2 and aliphatic diamines of formula R2N(CH2)mNR2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, the components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B).
申请公布号 US5382299(A) 申请公布日期 1995.01.17
申请号 US19940187738 申请日期 1994.01.28
申请人 COOKSON GROUP PLC 发明人 BALUCH, DOSTEN;INGHAM, ANTHONY E.
分类号 B23K1/00;B23K35/36;B23K35/363;B23K35/40;(IPC1-7):B23K35/34 主分类号 B23K1/00
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