DOUBLE-SIDED COPPER CLAD LAMINATED SHEET OF B-STAGE AND PRODUCTION OF METAL SUBSTRATE PRINTED WIRING BOARD USING THE SAME

摘要

PURPOSE:To obtain a double-sided copper clad laminated sheet used in a method for rationally obtaining a metal substrate printed wiring board without performing coating treatment for protecting a metal substrate at the time of the processing of a printed wiring board or the surface roughening treatment of a single-sided printed wiring board for facilitating the bonding of the single- sided printed wiring board to the metal substrate. CONSTITUTION:A double-sided copper clad laminated sheet 1 of a B-stage consists of an insulating layer 2 whose curing degree is a B-stage and the copper foils 3 arranged to both outsides thereof and the B-stage degree thereof is pref. obtained by curing the insulating layer 2 up to 80-95% of the final Tg of the layer 2. After circuits 4 are formed on the copper foils 3 of the double- sided copper clad laminated sheet of the B-stage, the insulating layer 2 of the B-stage is released and divided to form two single-sided printed wiring boards 6 and the insulating layer 2 of each of the single-sided printed wiring boards 6 is arranged on a metal substrate 5 and pressed thereto under heating to obtain a metal substrate printed wiring board.