| 摘要 |
<p>PURPOSE:To fill in a space between an electronic component and a panel, to stabilize a panel mounted state, and to eliminate adherence and peeling of the component due to stickiness of an adhesive layer provided on the panel by arranging a space filler between the component and the panel of an IC card. CONSTITUTION:A board 14 in which electronic components 13 are placed is supported to a frame 11 of a square shape having a connector 12 at one side face, and panels 17, 18 having adhesive layers 19, 20 mounted on and underneath the frame 11. This IC card is coated with resin solvent mixed with foaming agent on the components 13 or the panels 17, 18, and the solvent is foamed as a space filler. As a result, a space between the components and the panels is filled up with the filler, a panel mounted state is stabilized, and adherence, peeling of the component due to stickiness of the layer provided on the panel are eliminated thereby to obviate unpleasant peeling sound.</p> |
