| 发明名称 |
Automatische Bandmontagen-Packung für einen Halbleiterchip mit Entkupplung. |
| 摘要 |
A tape automated bonding package has a polymer layer (64) supporting leads, including ground and power leads, for coupling the chip to a printed circuit board. One or more decoupling capacitors (52,54,56,58) are connected directly to ground (62) and power (60) leads at positions closely adjacent the chip. |
| 申请公布号 |
DE3852291(D1) |
申请公布日期 |
1995.01.12 |
| 申请号 |
DE19883852291 |
申请日期 |
1988.12.13 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US |
发明人 |
FRANKENY, RICHARD FRANCIS, ELGIN TEXAS 78621, US;RAKES, JAMES MITCHELL, LEANDER TEXAS 78641, US |
| 分类号 |
H01L21/60;H01L23/495;H01L23/64;(IPC1-7):H01L23/64;H01L23/498 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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