| 摘要 |
The invention relates to the epoxy resin compound for encapsulation of semiconductor devices. The compound consists of 2-20 weight % of epoxy resin, 5-15 % of phenolic resin, 60-87 % of silica powers, and 0.05-5 % of separate or mixed silane coupling and titanium coupling agents. The compound has high resistance to heat, thermal stress and humidity. The compound are used for the package encapsulation and when they are used, the semiconductor devices are more compact and reliable.
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