| 摘要 |
In a method of producing small components, in particular pressure or similar sensors, which are made up of at least two individual units (5, 8) superimposed in layers, a wafer (2) is produced which has a plurality of individual semiconductor units (5). Additionally, a shaped connecting part (4) is produced which has a plurality of individual connecting units (8), the individual semiconductor units (5) and the individual connecting units (8) corresponding in terms of size to one another and being arranged regularly on the wafer (2) and the shaped connecting part (4), respectively. In a single method step, all individual units (5, 8) of the wafer (2) and the shaped connecting part (4) are joined to each other. This layered structure is then cut to form the small components. In order to contact the individual semiconductor units (5), a connecting foil comprising strip conductors along webs can be mounted onto the individual semiconductor units.
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