发明名称 |
Heat-resistant polyimide adhesive. |
摘要 |
<p>A polyimide-base heat-resistant adhesive having excellent peel strength and heat resistance comprising polyimide composed of 10 to 99 % by mole of structural units having the formula (1) and 1 to 90 % by mole of structural units having the formula (2) or comprising polyamic acid precursor which corresponds to the polyimide. <CHEM> <CHEM> a</p> |
申请公布号 |
EP0500292(B1) |
申请公布日期 |
1995.01.11 |
申请号 |
EP19920301272 |
申请日期 |
1992.02.17 |
申请人 |
MITSUI TOATSU CHEMICALS, INC. |
发明人 |
TAMAI, SHOJI;YAMAGUCHI, AKIHIRO;IIYAMA, KATSUAKI |
分类号 |
C08G73/10;(IPC1-7):C08G73/10;C09J179/08 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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