发明名称 Heat-resistant polyimide adhesive.
摘要 <p>A polyimide-base heat-resistant adhesive having excellent peel strength and heat resistance comprising polyimide composed of 10 to 99 % by mole of structural units having the formula (1) and 1 to 90 % by mole of structural units having the formula (2) or comprising polyamic acid precursor which corresponds to the polyimide. <CHEM> <CHEM> a</p>
申请公布号 EP0500292(B1) 申请公布日期 1995.01.11
申请号 EP19920301272 申请日期 1992.02.17
申请人 MITSUI TOATSU CHEMICALS, INC. 发明人 TAMAI, SHOJI;YAMAGUCHI, AKIHIRO;IIYAMA, KATSUAKI
分类号 C08G73/10;(IPC1-7):C08G73/10;C09J179/08 主分类号 C08G73/10
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