发明名称 |
Integrated circuit capacitor |
摘要 |
A method of manufacturing folded capacitors comprises the steps of: forming a first storage electrode and a first insulating layer; forming a first plate electrode and a second insulating layer thereon and forming a pad poly thereon; limiting the first plate electrode to a predetermined portion; leaving a spacer; forming a second storage electrode; and depositing a third insulating layer and a second plate electrode thereon. It is possible to manufacture a capacitor with a large capacitance and to simplify the manufacturing processes of the capacitor by using the conventional capacitor manufacturing processes. The folded capacitors with a larger capacitance per unit area can be obtained without making the insulating layer be thinned even if the plane area of the capacitor may be reduced remarkably according to a tendency to high integration density. |
申请公布号 |
GB2244861(B) |
申请公布日期 |
1995.01.11 |
申请号 |
GB19900012834 |
申请日期 |
1990.06.08 |
申请人 |
* SAMSUNG ELECTRONICS CO LIMITED |
发明人 |
OH-HYUN * KWON;TAEK-YONG * JANG;JUNG-HYUN * SHIN;WON-TAEK * CHOI |
分类号 |
H01L29/94;(IPC1-7):H01L27/108 |
主分类号 |
H01L29/94 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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