发明名称 Integrated circuit capacitor
摘要 A method of manufacturing folded capacitors comprises the steps of: forming a first storage electrode and a first insulating layer; forming a first plate electrode and a second insulating layer thereon and forming a pad poly thereon; limiting the first plate electrode to a predetermined portion; leaving a spacer; forming a second storage electrode; and depositing a third insulating layer and a second plate electrode thereon. It is possible to manufacture a capacitor with a large capacitance and to simplify the manufacturing processes of the capacitor by using the conventional capacitor manufacturing processes. The folded capacitors with a larger capacitance per unit area can be obtained without making the insulating layer be thinned even if the plane area of the capacitor may be reduced remarkably according to a tendency to high integration density.
申请公布号 GB2244861(B) 申请公布日期 1995.01.11
申请号 GB19900012834 申请日期 1990.06.08
申请人 * SAMSUNG ELECTRONICS CO LIMITED 发明人 OH-HYUN * KWON;TAEK-YONG * JANG;JUNG-HYUN * SHIN;WON-TAEK * CHOI
分类号 H01L29/94;(IPC1-7):H01L27/108 主分类号 H01L29/94
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