Polishing apparatus for notch portion of wafer.

摘要

Apparatus (1) for polishing a notch (32) on the periphery of a wafer (W) comprises: a table (2) for supporting the wafer; buff (7), adapted to polish the notch, which is rotatable about a first axis substantially parallel to the surface of the wafer; means (8) for rotating the buff; means (9) for supporting the buff; means (10) for adjusting the pressure applied by the buff to the notch; and means (4,4a,5,6) for rotating the table about a second axis which is substantially parallel to the first axis, so that the applied pressure acts on the bottom wall of the wafer, in the notch, in a direction substantially perpendicular to the surface of said bottom wall. <IMAGE>