| 摘要 |
PURPOSE:To prevent position deviation of inner layer circuit boards without using an adhesive tape, by forming a recessed part in the width direction, at the side end portion of one inner layer circuit board, forming a protruding part whose size in the width direction is nearly equal to the recessed part, at the side end portion of the other inner layer circuit board, and fitting and bonding them. CONSTITUTION:An inner later circuit board 1 is provided with a recessed part 4 or a protruding part 5, at the side end portion for fitting. The recessed part 4 is formed by cutting down the side end portion of the board 1 in the width direction. The protruding part 5 is formed as the residual part by cutting out both sides of the side end portion of the board 1. The recessed part 4 and the protruding part 5 are engaged with each other. Thus a plurality of the inner layer circuit boards 1 are bonded in the manner in which the respective side end faces are made to abut. Thereon and thereunder metal foils 3 like copper foils or outer layer circuit boards are stacked. These are made one unit; about ten units are set for one stage; these are heated and compression-bonded by a pressing machine. Thereby a multilayer wiring board wherein the metal foils 3 or the outer layer circuit boards are laminated on both sides of the inner circuit board 1 can be obtained. |
