Tiered socket assembly with integral ground shield.

摘要

A socket assembly (94) is provided for receiving memory modules (10) such as single in-line memory modules (SIMMs). The socket assembly includes at least one lower tier SIMM socket (24a) that is mountable to a board (96). A carrier (62) is mounted to the board (96) in generally parallel spaced relationship to the lower tier SIMM socket (24a). At least one upper tier SIMM socket (24b) is mounted to the carrier (62) and may be supported in part by a lower tier SIMM socket (24a). The carrier (62) includes a ground shield (84) for preventing interference.