发明名称 FORMING METHOD OF POLYCRYSTALLINE SEMICONDUCTOR THIN FILM
摘要 PURPOSE:To enhance a polycrystalline semiconductor thin film in grain diameter so as to use it as material for the active region of a semiconductor element by a method wherein a region of an amorphous semiconductor thin film is crystallized into a crystallized region as it is kept at a higher temperature than the other region of the semiconductor thin film that remains amorphous, and thereafter a polycrystalline layer is made to grow all over the surface of the thin film through thermal decomposition. CONSTITUTION:An amorphous silicon thin film 2 is grown on a substrate 1. Light pulses are condensed by a convex lens and turned into an optical beam 4, and the optical beam 4 is made to irradiate the substrate 1 through a slit as the substrate 1 is moved in a direction of an arrow 3 and in another direction vertical to the former so as to enable square regions 5, each 10X10mu<2>, to be alternately crystallized on the amorphous silicon film 2 at both a lateral interval of 50mum and a longitudinal interval of 50mum. Then, a specimen where the regions 5 are crystallized is irradiated with infrared rays radiated from an infrared lamp to selectively heat the crystallized regions 5, whereby the amorphous silicon regions 2 are heated through thermal conduction from the regions 5. A polycrystalline silicon thin film 7 is made to grow through a local hot CVD method till it covers all the surface of the amorphous silicon thin film 2.
申请公布号 JPH076960(A) 申请公布日期 1995.01.10
申请号 JP19930144111 申请日期 1993.06.16
申请人 FUJI ELECTRIC CO LTD 发明人 ASANO AKIHIKO
分类号 H01L21/20;H01L21/205;(IPC1-7):H01L21/205;H01L21/268 主分类号 H01L21/20
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