| 摘要 |
<p>PURPOSE: To provide a KGD array, conducting an AC test and a burn-in test through the use of a common IC chip separated from a wafer, without forming a wax bump, and to provide its manufacture method. CONSTITUTION: A lead frame 30 provided with plural die pads 32 which are supported by tie-bars 38 and are regularly arranged, an adhesive 35 applied on the die pads 32 on the lead frame 30 and plural KGDs without defects, which are adhered by individual die on the respective die pads 32, on which adhesive is applied and whose final test is terminated, are provided.</p> |
