| 摘要 |
PURPOSE:To prevent generation of void by providing a dielectric both-sided adhesive tape with a plurality of through holes and slits and providing a half etch oppositely to the slit at the tip of an inner lead thereby eliminating the unbonded part. CONSTITUTION:A dielectric both-sided adhesive tape 13 having a plurality of through holes 13a and slits 13b is applied to the surface of a device 1. An inner lead 12 is then applied to the adhesive tape 13 with the half etch 12a of the inner lead 12 opposing each slit 13b and then they are subjected to thermocompression. Since the air is not captured between the surface of the device 1 and the adhesive tape 13, unbonded part can be eliminated. When the entirety is sealed, the sealing material 7 enters into the through holes 13b and into the gap between the half etch 12a and the slit 13b, generation of void can be prevented in the adhesive of the dielectric both-sided adhesive tape 13 beneath the inner lead 12. |
