| 摘要 |
PURPOSE:To eliminate adherence of residue of an insulation coating to a bonding position by positioning a connector of a printed wiring board and a wire bonding tool to connect both, peeling the coating near the tool, and connecting it to the connector of the board. CONSTITUTION:When a metal ball is formed at an end of a wire 2, the pressing surface of a wire bonding tool 7 is brought into contact with a predetermined bonding part of a printed wiring board 3 to reach a predetermined applied pressure, a pulse current flows from a pulse heating power source 21 to the surface, and the wire 2 is connected to the connector of the board 3. Then, the tool 7 is positioned to the next connector, the output of a laser oscillator 19 is set to be small, and the wire 2 is peeled only at an insulation coating by emitting a laser beam 26. Thereafter, the surface of the tool 7 is brought into contact with the connector of the board 3, and the wire 2 is connected to the connector of the board 3. |
