| 摘要 |
<p>PURPOSE:To facilitate connection of electronic component required for addition or modification of wiring even after a semiconductor package is mounted on a printed wiring board by making a wiring hole at the flat part of a lead terminal led out to the outside of the semiconductor package. CONSTITUTION:A wiring hole 7 is made at the flat part of a lead terminal for inputting/outputting signal led out from the opposite sides of a DIP type semiconductor package 1. When the semiconductor package 1 is mounted on a printed wiring board 3, the forward end of the lead 2 is inserted into a through hole 3a of the printed wiring board 3 and secured by means of a solder 4 on the rear. When addition or modification of wiring is required after mounting of the semiconductor package 1, a wire 6 is passed through the wiring hole 7 and entangled thereabout thus allowing connection of each lead terminal 2 on the surface side of the printed wiring board 3.</p> |
