| 摘要 |
PURPOSE: To reduce production cost and to provide satisfactory performance and reliability by protecting an integrated circuit(IC) from an environment by sealing the bond pad of an IC with a diffusion barrier layer and sealing the remaining part of device with an inactive layer. CONSTITUTION: On the surface of sub-assembly and a bond pad 2 of an IC 1, a primary inactive layer 3 is added. The primary inactive layer 3 is etched, one part on the top surface of the bond pad 2 is exposed, and a diffusion barrier metal layer 4 is added on one part at least of bond pad top surface, exposed through the primary inactive layer. Then, a secondary inactive layer 5 is added to the edge parts of the primary inactive layer 3 and diffusion barrier metal layer 4, so that the device can be sealed. Thus, all the holes, pinholes and defects on the primary inactive layer 3 are sealed, the edge part of diffusion barrier metal layer 4 is sealed, and complete sealing can be guaranteed. |
