Semiconductor device having passivation protrusions defining electrical bonding area

摘要

An electrode construction intended to facilitate soldering with a semiconductor disc element having a pair of electrode plates soldered to a semiconductor chip with the semiconductor chip held between the electrode plates. A stepped protrusion is disposed on the central part of each electrode plate such that the stepped protrusion is directed into a solder joint of the semiconductor chip. While the stepped protrusion is held in the solder joint of the semiconductor chip, the electrode plate floats above a passivation on the semiconductor chip side before being soldered to the semiconductor chip. The electrode plates have orientation slits and orientation flats as references for positioning purposes. The electrode plates, semiconductor chip, and stepped protrusions are protected by a uniform layer of shrinkage tube.