| 摘要 |
PURPOSE:To provide a means which is capable of repairing (replacing) a flip chip easily in the case when NG is detected in product testing during a packaging process which mounts the flip chip on a board. CONSTITUTION:Production testing is carried out in a stage in which an elastic ring 16 is interposed between a flip chip 11 and a board 1; the flip chip 11 is loaded on the board 13 and an inner space T of the elastic ring 16 is vacuum- attracted so that the flip chip 11 may be temporarily attached to the board 13. If the detection result is NG, the flip chip 11 is repaired or replaced. If it is acceptable, the flip chip 11 is bonded with the board 13 with a bonding agent 15. Therefore, it is possible to carry out product testing before the flip chip 11 is bonded with the board 13 with the bonding agent 15, which makes it possible to repair the flip chip 11 easily if the inspection result is NG. |
