| 摘要 |
PURPOSE:To provide a semiconductor device in which the cavity of a package body can be sealed easily even if the open area thereof is enlarged. CONSTITUTION:In a semiconductor device wherein a semiconductor chip 16 mounted in a cavity of a package body 10 is bonded to a conductor pattern through a wire 18, a hardened layer 14 of silicon gel exhibiting the elasticity of rubber is applied tightly, while exposing a hardened surface, onto a layer 12 of silicon gel filled in the cavity in order to seal the semiconductor chip 16 and the wire 18. |
