| 摘要 |
PURPOSE:To stably supply an IC chip component by a simple, small-sized low- cost apparatus. CONSTITUTION:The IC chip component supplying apparatus comprises elevating means 4 for detachably supporting and vertically moving a wafer magazine 2 so containing and holding many adhesive sheets 1 each adhered with a wafer 11 in many stages as to be individually removed and inserted, and transfer means 10 for removing the sheet 1 contained and held in the magazine 2 at a predetermined height position, transferring the sheet 1 to an IC chip supplying position to pick up an IC chip component 11a and transferring the sheet 1 disposed at this IC chip component supplying position to contain the sheet in the magazine 2. |
