PROCESSING OF INTEGRATED CIRCUIT IN WAFER FORM AFTER CUTTING INTO CHIP

摘要

PURPOSE: To provide a process for manufacturing a device that is free from fabrication debris, particularly a micromechanical device such as DMDs, wherein a wafer is allowed to be sawn before the completion of all processing steps. CONSTITUTION: A device, which is easy too fragile to allow cleaning after a device manufacturing process has ended. To overcome this problem, a wafer is sawed and cleaned prior to a series of manufacturing steps that makes the device fragile. To avoid processing chips 30 individually, a substrate wafer 28 is attached to the backside of a dicing tape 24. Since the wafer 28 holds the sawn chips 30 well aligned, the chips 30 can be subjected to the remaining manufacturing steps in the form of a wafer.