| 摘要 |
<p>PURPOSE:To avoid projection of a semiconductor device from a mounting board by forming a receiving recess in a mounting board body, inserting a semiconductor device therein, and connecting the outer leads of the semiconductor device electrically and mechanically with contacts formed around the opening of the recess. CONSTITUTION:A semiconductor device 15 is inserted into a receiving hole 24 made in a mounting board 22 with the end face side thereof, from which a group of outer leads 8 of a package 4 projects, directing upward. Consequently, each outer lead 8 of the semiconductor device 15 is connected, on the lower face side thereof, with a solder cream placed on each land 25 formed around the opening of the receiving hole 24 made in the upper face of the mounting board 22. When the solder cream is fused by reflow soldering and eventually solidified, each outer lead 8 is connected electrically and mechanically with the land 25 through a solder bump layer 27. This structure allows mounting of the semiconductor device 15 onto the mounting board 22 without projecting the device 15 from the upper face of the board 22 thus realizing reduction of overall height.</p> |
