| 摘要 |
<p>PURPOSE: To set the electric connection of a flexible film carrier and an electronic device to be complete by matching the flexible film carrier with solder mounds, adding force to the solder mounds, engaging the lead conductors of the thin-film carrier, so that they are bent and melt an engaged part. CONSTITUTION: Contact positions 17 are provided on an electronic device 13a, and the solder mounds 19 are positioned at the respective contact positions 17. Then, a flexible film carrier 11 is matched with the solder mounds 19. The carrier is brought into contact with the solder mound 19, to which respective lead conductors 33 correspond, a prescribed force is added to the solder mound 19 and the film carrier 11 is engaged, so that the respective lead conductors 33 are bent on the solder mound 19. Then, the engaged part is heated to a temperature to be made into a melted state and they is cooled. Consequently, the complete electric connection is formed between the film carrier and the electronic device.</p> |
