| 摘要 |
PURPOSE:To speed up bonding work with regards to a wire bonding method. CONSTITUTION:A wire 1 is vertically inserted into a capillary 11. When an area between two point is wired by performing a first bonding work and second binding work by moving this capillary 11, the first bonding work allows the capillary 11 to be lowered without melting the projected wire 1 and forming ball. What is more, the projected wire 1 is bent so that its side surfaces may come into contact with a connection member and then bonding work is carried out. The capillary 11, which is lowered to bend the projected wire 1, is slanted. The direction from the first the bonding to the second bonding is alternately reversed, say, from a chip 2 to a lead 4 and then from the lead 4 to the chip 2. |
