发明名称 MULTICHIP MODULE INTEGRATED CIRCUIT DEVICE HAVING MAXIMUM INPUT/OUTPUT CAPABILITY
摘要 PURPOSE: To improve the I/O capability of integrated circuit by providing an integrated circuit device with an array of functional circuits which are equipped with plural inputs and at least one output and overlapping programmable interconnect architecture, including interconnect conductors on the array of functional circuits. CONSTITUTION: At a high-speed I/O count integrated circuit 10, inputs 14a-14d, 16a-16d, 18a-18d and 20a-20d and outputs 22a-22d and 24a-24d of functional circuits 12a-12d are connected to access conductors in an interconnect architecture, overlapped on the functional circuit array. For example, horizontal interconnect conductors 26, 28, 30 and 32 are arranged under 1st columns 12a and 12b of functional circuits and interconnect conductors 34, 36, 38 and 40 are arranged under 2nd columns 12c and 12d of the functional circuits. Vertical interconnect conductors 42, 44, 46 and 48 are arranged on the left side of 1st longitudinal rows 12a and 12c of the functional circuits, and vertical interconnect conductors 50, 52, 54 and 56 and arranged on the left side of 2nd longitudinal rows 12b and 12d of the functional circuits.
申请公布号 JPH077128(A) 申请公布日期 1995.01.10
申请号 JP19930277459 申请日期 1993.10.08
申请人 APUTEIKUSU CORP 发明人 AMURU MOOSEN
分类号 H01L23/525;H01L23/538;H01L25/065;H01L27/118;H03K19/177;(IPC1-7):H01L23/538 主分类号 H01L23/525
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