| 摘要 |
PURPOSE: To provide a heat resistant and chemical resistant relief structural body having specially high transparency in i rays and high photosensitivity at 200∼600nm and suitable for producing a polyimide protective lacquer in the electronics field. CONSTITUTION: A photopolymerizable composition consisting of a polyimide precursor containing repetitive units shown in the formula and a photoinitiator is applied on a base material, exposed with i-ray in an image pattern, and then unexposed parts are removed and conditioning is performed to the result. In the formula, as examples of groups, X is a tetravalent group of oxydiphthalic acid, Y is a divalent group of an aromatic diamine, A is -COO-, and R1 is CH2 = CH(CH3 )COOC2 H4 -. |
