发明名称 |
Low cost electroless plating process for single chips and wafer parts and products obtained thereof |
摘要 |
The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
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申请公布号 |
US2002001670(A1) |
申请公布日期 |
2002.01.03 |
申请号 |
US20010841359 |
申请日期 |
2001.04.24 |
申请人 |
PAUW HERBERT DE;VANFLETEREN JAN;ZHANG SUIXIN |
发明人 |
PAUW HERBERT DE;VANFLETEREN JAN;ZHANG SUIXIN |
分类号 |
H01L21/288;H01L21/60;H01L21/68;H01L23/485;(IPC1-7):B05D5/12;B05D1/18 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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