发明名称 PRODUCTION OF MODIFIED POLYPHENYLENE OXIDE RESIN SYSTEM FOR ELECTRICAL LAMINATE BOARD WITH IMPROVED SOLDABILITY AND SOLVENT RESISTANCE
摘要 Broadly, the present invention comprises a solventless process wherein blends of thermoset polyphenylene oxide and triallylcyanurates can be processed into fiber reinforced laminates, and especially laminates prepared by the Wiggins Teape process. One aspect of the present inventive process comprises blending the polyphenylene powder with a liquid epoxy material, optionally with flame retardants and catalysts, preferably in a high shear mixer at elevated temperature, e.g. in the range of about 100 DEG -130 DEG C. The resultant upstaged or partially-cured blend is sufficiently solidified to be granulated into a powder for Wiggins Teape processing or, optionally, conventional press processing into a fiber reinforced laminates. Resin systems thus-prepared exhibit both improved solderability resistance and improved resistance to organic solvents when compared to thermoplastic systems.
申请公布号 JPH073053(A) 申请公布日期 1995.01.06
申请号 JP19940011274 申请日期 1994.02.03
申请人 GENERAL ELECTRIC CO <GE> 发明人 KURISUCHIYAN KINGU UEBAA;MAIKERU JIERARUDO MINITSUKU
分类号 C08G59/40;C08J5/24;C08L63/00;C08L71/12;H05K1/03;(IPC1-7):C08J5/24 主分类号 C08G59/40
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