| 摘要 |
processes and apparatuses for mounting/demounting integrated circuits with electric and electronic components. SUBSTANCE: heat dispersing plate is mounted in lower opening of flared body of tip with possibility of acting upon said plate with hot gas. There is at least one through hole for hot gas passing between edge of plate and tip body. In order to provide uniform distribution of heat at simultaneous reduction of hot gas discharge, in zone spaced by some distance from through hole there is at least one return opening. EFFECT: enhanced uniformness of distribution of discharged hot gas. 28 cl, 5 dwg
|
