| 摘要 |
PURPOSE:To prepare a conductive resin composition excellent in dispersion of a metal fiber, conductivity and moldability, useful for an electronic equipment, etc., by applying a thermoplastic resin coating layer to a conductive filler composed of a metal fiber having a specified-ratio and specified-thickness low- melting metal layer formed on the surface. CONSTITUTION:The objective composition is prepared by forming (B) a 1 to 5mum thick low-melting metal layer (e.g. general solder alloy) on (A) the surface of a metal fiber (especially preferably copper fiber) in a ratio of 5 to 30wt.% component (B) based on the component (A), coating integrally the resultant conductive filler with (C) a thermoplastic resin layer (e.g. PE resin or PP resin) and cutting it into pellets. |
