| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent adhesiveness and effective particularly in joining constituent members of an ink jet head. SOLUTION: The epoxy resin composition contains at least a liquid epoxy resin and a liquid curing agent, and is solventless. An example of the liquid epoxy resin preferably used comprises one containing at least a bisphenol epoxy resin. In an example, a bisphenol A epoxy resin and 2-ethyl-4-methylimidazole are mixed under stirring to prepare an epoxy resin composition, this composition is used to bond an Ni plate to an Si wafer, and the bond strength and ink resistance of the joined material are tested to give excellent results. The epoxy resin composition of this invention is very useful as an adhesive for bonding the constituent members of an ink jet head to each other, for example, for bonding a static actuator 401 to a nozzle plate 404.
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