| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-cutting apparatus that cuts a substrate into each element for accommodating in an accommodation tray, without using frames or tapes. SOLUTION: This substrate-cutting apparatus comprises a chuck table 3 that directly sucks and retains the substrate W, a first transfer mechanism 4 that transfers the substrate W to the chuck table 3, a cut-off mechanism 5 that cuts the substrate W that is sucked and retained to the chuck table 3 into each element, a second transfer mechanism 7 that transfers each cut element on the chuck plate 3 at an element receiving position to placement plates 6a and 6b reciprocating between the element receiving position and an element extracting one, slide mechanisms 8a and 8b that allow the placement plates 6a and 6b to cause it to reciprocate between the element receiving and extracting positions, and a pickup-and-place mechanism 10 that picks up each element on the placement plates 6a and 6b at the element extracting position for accommodating into the accommodation tray 9. |
