| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which enables to efficiently cool a semiconductor chip from both sides. SOLUTION: The semiconductor module comprises a first heat conductive insulating base (10) having a circuit pattern connected to a first main surface (30a) of the semiconductor chip (30) which is a heat source, a second heat conductive insulating base (20) having a circuit pattern connected to the other surface of the chip, heat conduction elements (40) enabling heat conduction between the first heat conductive insulating base and the second heat conductive insulating base and a heat sink arranged at least on one base of the first heat conductive insulating base and the second heat conductive insulating base. |
