| 摘要 |
<p>A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, 'tub'-like structure (10). The tub-like structure is comprised of a laminated stack of thin layers (11) of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die (18), that has been mounted at a floor portion of the tub, may be elecrically connected to a plurality of conductive recesses or pockets located at top (81) and bottom (87) sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.</p> |
