| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the operation rate and throughput of a substrate treating device by surely detecting the abnormal insertion of a wafer and improving the detection precision of the wafer. SOLUTION: In the substrate treating device provided with a substrate detection device for detecting the state of a substrate inserted in a substrate holding tool 10, the substrate detection device is provided with at least two pairs of light sensors 20a, 20b, one light sensor 20a is arranged so that a light axis 22a for a plane including a positively opposed substrate insertion groove is intersected, the other light sensor 20b includes a light axis 22b between two planes including the positively opposed substrate insertion groove, the light axis is a center line of the substrate holding tool, and is oblique for at least one of the planes including the positively opposed substrate insertion groove.</p> |
