发明名称 |
METHOD AND APPARATUS FOR NON-CONDUCTIVELY INTERCONNECTING INTEGRATED CIRCUITS |
摘要 |
A method and apparatus for constructing, repairing and operating modular electronic systems utilize peripheral half-capacitors (14, 15) (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/repairability and greater density then conventional modular packaging techniques, such as printed circuit board (10) and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described. |
申请公布号 |
WO9501087(A1) |
申请公布日期 |
1995.01.05 |
申请号 |
WO1994US07238 |
申请日期 |
1994.06.24 |
申请人 |
KNIGHT, THOMAS, F.;SALZMAN, DAVID, B. |
发明人 |
KNIGHT, THOMAS, F.;SALZMAN, DAVID, B. |
分类号 |
G01R31/26;G01R31/312;H01L21/66;H01L23/48;H01L23/52;H01L23/538;H01L23/64;H01L25/00;H01L25/065;H01L25/07;H01L25/18;H03K19/0175 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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