Method of forming a thin copper film by low temperature CVD.,申请号EP19900402924-传众专利搜索

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发明名称	Method of forming a thin copper film by low temperature CVD.
摘要
申请公布号	EP0482265(B1)	申请公布日期	1995.01.04
申请号	EP19900402924	申请日期	1990.10.18
申请人	L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE	发明人	CLAVERIE, PIERRE;KIMURA, MASAO;ARAI, JUICHI;JALBY, PIERRE
分类号	C23C16/08;C23C16/14;C23C16/44;C23C16/448;C23C16/452;C23C16/455;H01L21/3205;(IPC1-7):C23C16/08	主分类号	C23C16/08
代理机构		代理人
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