发明名称 |
Ceramic substrate and manufacturing method thereof. |
摘要 |
The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer. <IMAGE> |
申请公布号 |
EP0609861(A3) |
申请公布日期 |
1995.01.04 |
申请号 |
EP19940101559 |
申请日期 |
1994.02.02 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NAKAMURA YOSHIFUMI;BESSHO YOSHIHIRO;YUHAKU SATORU;HAKOTANI YASUHIKO;ITAGAKI MINEHIRO;MIURA KAZUHIRO |
分类号 |
H01L21/48;H05K1/03;H05K1/09;H05K3/40;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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