| 摘要 |
To provide a packing box for lead terminal type semiconductor products, including insulated gate type semiconductor devices such as MOSFETs and IGBTs, that enables the products in the box to be held securely in place, that allows packing and removal of the products to be done easily, and which prevents gate breakdown due to electrostatic voltages, there is provided a packing box (3) for single in-line lead terminal type semiconductor devices (4), including insulated gate type semiconductor devices, that comprises a box body (3a), internal partitions (3b), and a cover (3c). A conductive foam or sponge (6) also used as a cushioned packing material is attached to the internal surface of the cover (3c), and the semiconductor products (4) are placed in the packing box (3) with their lead terminals (2) directed upwardly. In this packed state, the conductive foam or sponge (6) is pressed against the lead terminals (2) to collectively hold the semiconductor products (4) securely in the box (3), thereby causing short-circuiting between the lead terminals (2) to prevent gate break down as a result of electrostatic voltage. <IMAGE>
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